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Electoplating Material Copper Pyrophosphate
Chemical Name: Copper Pyrophosphate
Synonyms: Caswell No. 252; Copper (II) Pyrophosphate
CAS No.: 10102-90-6
Relative molecular mass:301.04
Molecular Formula: Cu2P2O7
Pale green powder. Dissolves in acid, does not dissolve in water. May have complex reaction with the potassium pyrophosphate, becoming water-soluble pyrophosphoric acid copper potassium complex salt.
Specifications:
Items | Special Grade |
Assay(Cu) | 34.0 |
Insoluble matter in potassium pyrophosphate, % ≤ | 0.1 |
Sodium(Na), % ≤ | 0.5 |
Lead(Pb), % ≤ | 0.003 |
Iron(Fe), % ≤ | 0.01 |
Arsenic(As), % ≤ | 0.0003 |
Chloride(Cl), % ≤ | 0.01 |
Zinc(Zn), % ≤ | 0.005 |
Application:
Mainly applied for the cyanide-less ectroplating, is the main salt to supply cupric ion in bath. Used in the bottom of copper for the ornamental protection course and part of anti-carburization accessories.
Packing:
25kgs in PE/PP bags or paper drums, 500/1000 kgs in PP bag, 200kgs in metal drum or per clint's requirement.